COMPOSITE MATERIAL

A composite material 1 according to the present invention includes a solid portion 10 including inorganic particles 20 and a resin 30. The composite material 1 has a porous structure including a plurality of voids 40 surrounded by the solid portion 10. In the composite material 1, a value P1 determi...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	OTSUKA Tetsuya, MIMURA Takanobu, KATO Tomoya
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADHESIVES AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES GENERAL PROCESSES OF COMPOUNDING MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A composite material 1 according to the present invention includes a solid portion 10 including inorganic particles 20 and a resin 30. The composite material 1 has a porous structure including a plurality of voids 40 surrounded by the solid portion 10. In the composite material 1, a value P1 determined by the following equation (1) is 6 or more. In the equation (1), a heat conductivity is a value measured for one test specimen in a symmetric configuration according to an American Society for Testing and Materials (ASTM) standard D5470-01. P1=theheatconductivityW/m·Kofthecompositematerial1/anamountvolume%oftheinorganicparticles20×100