RESIN COMPOSITION FOR MOLDING, AND MOLDED BODY

Provided is a resin composition for molding containing a polyarylene sulfide resin that forms a molded body having all of mechanical strength, heat cycle characteristics, and thermal conductivity in a well-balanced manner. Specifically, provided are a resin composition for molding containing a plate...

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Bibliographische Detailangaben
Hauptverfasser: KANEMATSU, Takayuki, TAKADA, Shingo, ABE, Fumiaki, NARA, Saori, ASANO, Kiichi
Format: Patent
Sprache:eng ; fre ; ger
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Beschreibung
Zusammenfassung:Provided is a resin composition for molding containing a polyarylene sulfide resin that forms a molded body having all of mechanical strength, heat cycle characteristics, and thermal conductivity in a well-balanced manner. Specifically, provided are a resin composition for molding containing a plate-like filler having an aspect ratio of 10 to 500 (A), a polyarylene sulfide resin (B), a thermoplastic resin having a glass transition temperature (Tg) of 20°C or lower (C), and glass fibers (D) as essential components, the plate-like filler (A) being contained in an amount of 30 to 70 parts by mass relative to 100 parts by mass of the sum of the plate-like filler (A), the polyarylene sulfide resin (B), the thermoplastic resin (C), and the glass fibers (D), and a molded body of the resin composition for molding.