ONE-COMPONENT THERMOSETTING EPOXY COMPOSITION WITH IMPROVED ADHESION
The present invention relates to a one-component thermosetting epoxy resin composition, comprising at least one epoxy resin A having on average more than one epoxide group per molecule, at least one latent hardener B for epoxy resins, at least one impact modifier D, at least one physical or chemical...
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Format: | Patent |
Sprache: | eng ; fre ; ger |
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Zusammenfassung: | The present invention relates to a one-component thermosetting epoxy resin composition, comprising at least one epoxy resin A having on average more than one epoxide group per molecule, at least one latent hardener B for epoxy resins, at least one impact modifier D, at least one physical or chemical blowing agent E and fibrous anhydrous magnesium oxysulfate MOS. The invention provides thermally expandable epoxy resin compositions with improved adhesion, especially on metal substrates. |
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