CONNECTION OF COMPONENTS

A connection element (6) for connecting a first component (2) to a second component (3) has, on a first connection surface (7) on a first side (10) of the connection element (6) and on a second connection surface (8) on a second side (11) of the connection element (6) opposite the first side (10), a respective plurality of nanowires (1), and the first connection surface (7) and the second connection surface (8) are electrically insulated from each other. A method for connecting a first component (2) to a second component (3) has the steps of: a) providing the connection element (6), b) bringing together a contact surface (4) of the first component (2) and the first connection surface (7) of the connection element (6), and c) bringing together a contact surface (5) of the second component (3) and the second connection surface (8) of the connection element (6). Steps b) and/or c) can be carried out at room temperature. The method can further have the step of d) heating at least the contact surfaces (4, 5) to a temperature of at least 90°C. In steps b) and/or c) the connection element (6), the first component (2) and/or the second component (3) can be exposed to the action of ultrasound. The connection element (6) can also have a respective plurality of nanowires (1) on a third connection surface (20) on the first side (10) of the connection element (6) and on a fourth connection surface (21) on the second side (11) of the connection element (6), and the third connection surface (20) and the fourth connection surface (21) are electrically conductively connected to each other. The method further has the steps of: b') bringing together a contact surface (18) of a third component (16) and the third connection surface (20) of the connection element (6), and c') bringing together a contact surface (19) of a fourth component (17) and the fourth connection surface (21) of the connection element (6). The connection element (6) can be in the form of a film and can be formed from a ceramic material in the region between the first connection surface (7) and the second connection surface (8). An arrangement (12) can comprise: a first component (2), a first connection element (6), a functional element (13), a second connection element (14) and a second component (3), the functional element (13) having one or more of the following functions: heat removal, damping of vibrations, mechanical stabilization. Alternatively, a method for connecting a first contact surface (2) to