MOLDED SEMICONDUCTOR CHIP PACKAGE WITH STAIR-STEP MOLDING LAYER

MOLDED SEMICONDUCTOR CHIP PACKAGE WITH STAIR-STEP MOLDING LAYER

Various molded semiconductor chip packages are disclosed. In one aspect, a semiconductor chip package includes a routing substrate and a semiconductor chip mounted on and electrically connected to the routing substrate. The semiconductor chip has plural side surfaces. A molding layer at least partia...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: BHAGAVAT, Milind S, SHAH, Priyal, CHENG, Chia-Hao, AGARWAL, Rahul
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:Various molded semiconductor chip packages are disclosed. In one aspect, a semiconductor chip package includes a routing substrate and a semiconductor chip mounted on and electrically connected to the routing substrate. The semiconductor chip has plural side surfaces. A molding layer at least partially encases the semiconductor chip. The molding layer has a tread and a riser, the riser abutting at least some of the side surfaces.