POWER CONVERSION UNIT AND POWER CONVERSION DEVICE

This power conversion unit (U) of the present invention comprises a cooling path (11) arranged between an input side power conversion unit (14) and an output side power conversion unit (15) that are divided into one side and another side and installed facing each other. The input side power conversi...

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Bibliographische Detailangaben
Hauptverfasser:	AMOU, Satoru, YOSHITAKE, Yuuichirou, MOTEKI, Ryou
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC,OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWERSUPPLY SYSTEMS BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CONTROL OR REGULATION THEREOF CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUTPOWER CONVERSION OR DISTRIBUTION OF ELECTRIC POWER ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERATION MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	This power conversion unit (U) of the present invention comprises a cooling path (11) arranged between an input side power conversion unit (14) and an output side power conversion unit (15) that are divided into one side and another side and installed facing each other. The input side power conversion unit (14) and the output side power conversion unit (15) comprise: a mold resin (9) that is filled in a space (p) inside cases (5a, 5b) in which wiring boards (2) are arranged; switching elements (1) covered by the mold resin (9) provided inside the spaces (p); upper electrode plates (7) connected to the switching elements (1) and covered by the mold resin (9); heat dissipation plates (12) with insulating properties that are connected to the upper electrode plates (7), and covered by the mold resin (9); and lower electrodes (8) provided in contact with or in close proximity to the cooling path (11). The heat dissipation plates (12) are wider than the upper electrode plates (7), and the upper electrode plates (7) are arranged closer to the center away from the edges of the heat dissipation plates (12).