A SEMICONDUCTOR POWER MODULE WITH TWO DIFFERENT POTTING MATERIALS AND A METHOD FOR FABRICATING THE SAME

A semiconductor power module (10) comprises an insulating interposer (1) comprising an insulative layer (1A) disposed between a lower metal layer, a first upper metal layer (1B) and a second upper metal layer (1C), a semiconductor transistor die (2) disposed on the first upper metal layer (1B), an e...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	FUERGUT, Edward, MAYER, Martin, HARTUNG, Hans
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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