POWER SEMICONDUCTOR MODULE WITH AT LEAST ONE POWER SEMICONDUCTOR ELEMENT
A power semiconductor module includes a power semiconductor element. In order to reduce the required installation space of the power semiconductor module and to increase the service of the power semiconductor module, the power semiconductor element is connected in an electrically insulating and ther...
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Format: | Patent |
Sprache: | eng ; fre ; ger |
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Zusammenfassung: | A power semiconductor module includes a power semiconductor element. In order to reduce the required installation space of the power semiconductor module and to increase the service of the power semiconductor module, the power semiconductor element is connected in an electrically insulating and thermally conductive manner to a cooling element via a dielectric material layer. The dielectric material layer is laid flat on a surface of the cooling element and force-lockingly connected to the cooling element by a first force acting orthogonal to the surface of the cooling element. |
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