ADHESIVE COMPOSTION, AND COVERLAY FILM AND PRINTED CIRCUIT BOARD THAT INCLUDE SAME

The present invention relates to an adhesive composition, and a coverlay film and a printed circuit board that include same. The adhesive composition includes: (a) an epoxy resin; and (b) a binder resin including epoxidized polybutadiene rubber and at least two kinds of rubber.

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Bibliographische Detailangaben
Hauptverfasser:	CHAE, Dongho, PARK, Kwangseok, JEONG, Inki, PARK, Subyung, RYU, Euidock
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The present invention relates to an adhesive composition, and a coverlay film and a printed circuit board that include same. The adhesive composition includes: (a) an epoxy resin; and (b) a binder resin including epoxidized polybutadiene rubber and at least two kinds of rubber.