CARRIER FILM FOR SEMICONDUCTOR WAFER PROCESSING

A carrier film includes an adhesive layer, a core layer, and a release layer. The adhesive layer includes a hydrogenated styrene block copolymer having a storage modulus (G′) of less than or equal to 400 kPa at 25° C., and a first polyolefin elastomer. The core layer includes a second polyolefin ela...

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Bibliographische Detailangaben
Hauptverfasser:	RAY, Carl Douglas, SSUBRAMANIAM, Surya, BRADY, Kevin A
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS POLISHES SEMICONDUCTOR DEVICES TRANSPORTING USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	A carrier film includes an adhesive layer, a core layer, and a release layer. The adhesive layer includes a hydrogenated styrene block copolymer having a storage modulus (G′) of less than or equal to 400 kPa at 25° C., and a first polyolefin elastomer. The core layer includes a second polyolefin elastomer, and the release layer includes a polyolefin.