METHODS AND APPARATUSES FOR SEALING MECHANISMS FOR REALIZING ADHESIVE CONNECTIONS WITH ADDITIVELY MANUFACTURED COMPONENTS

A node may be additively manufactured. The node may include a first surface and a second surface, and the second surface may bound a recess of the node. A structure may be inserted into the recess. A sealing member extend away from the second surface and contact the structure, such that a sealed spa...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	OKOLI, Chukwubuikem Marcel, MARTINEZ, Antonio Bernerd, EL NAGA, Eahab Nagi, KREIG, William David, TENHOUTEN, David Brian
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL ATOMISING APPARATUS BLASTING CASTING DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS ORMACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS,CLIPS, WEDGES, JOINTS OR JOINTING ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS HEATING LIGHTING MAKING METALLIC POWDER MANUFACTURE OF ARTICLES FROM METALLIC POWDER MECHANICAL ENGINEERING NOZZLES PERFORMING OPERATIONS POWDER METALLURGY SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS SPRAYING APPARATUS SPRAYING OR ATOMISING IN GENERAL THERMAL INSULATION IN GENERAL TRANSPORTING WEAPONS WORKING METALLIC POWDER WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A node may be additively manufactured. The node may include a first surface and a second surface, and the second surface may bound a recess of the node. A structure may be inserted into the recess. A sealing member extend away from the second surface and contact the structure, such that a sealed space may be created between the node and the structure. An adhesive may be applied in the sealed space to at least partially attach the structure to the node.