METHOD FOR MONITORING AT LEAST ONE ADHESIVE POINT USING A MONITORING SYSTEM, AND MONITORING SYSTEM FOR MONITORING AT LEAST ONE ADHESIVE POINT

METHOD FOR MONITORING AT LEAST ONE ADHESIVE POINT USING A MONITORING SYSTEM, AND MONITORING SYSTEM FOR MONITORING AT LEAST ONE ADHESIVE POINT

The invention relates to a method for monitoring at least one adhesive point using a monitoring system, the at least one adhesive point being monitored by a monitoring process for at least one cylinder cover (629). The monitoring system has at least one monitoring device (631), wherein the at least...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: SINGER, Stefan
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
LINING MACHINES
PERFORMING OPERATIONS
PRINTING
PRINTING MACHINES OR PRESSES
STAMPS
TRANSPORTING
TYPEWRITERS
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Beschreibung
Zusammenfassung:The invention relates to a method for monitoring at least one adhesive point using a monitoring system, the at least one adhesive point being monitored by a monitoring process for at least one cylinder cover (629). The monitoring system has at least one monitoring device (631), wherein the at least one monitoring device (631) has at least one image capturing device, and the at least one monitoring device (631) monitors at least one free surface of the at least one cylinder cover (629). The at least one free surface is a region of the cylinder cover (629) which corresponds to the at least one adhesive point of at least one sheet (02), and the at least one monitoring device (631) detects the actual state of the at least one free surface of the at least one cylinder cover (629) before the cylinder cover is stretched onto at least one plate cylinder (616) of at least one application assembly (600) of a processing machine (01). The actual state of the at least one free surface is compared with a target state of the at least one free surface, and at least one signal is generated on the basis of the comparison. The invention also relates to an additional method for monitoring at least one adhesive point using a monitoring system and to monitoring systems for monitoring at least one adhesive point.