RESIN COMPOSITION, MOLDED ARTICLE, AND METHOD FOR PRODUCING MOLDED ARTICLE

The disclosure provides a resin composition having high heat dissipation and low relative permittivity while also having excellent moldability. The disclosure relates to a resin composition containing: a melt-fabricable fluororesin containing at least one functional group selected from the group con...

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Bibliographische Detailangaben
Hauptverfasser: NAKAUE, Ayane, ITO, Hiroshi, KOMORI, Masaji, MUKAE, Hirofumi, KONO, Hideki
Format: Patent
Sprache:eng ; fre ; ger
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Beschreibung
Zusammenfassung:The disclosure provides a resin composition having high heat dissipation and low relative permittivity while also having excellent moldability. The disclosure relates to a resin composition containing: a melt-fabricable fluororesin containing at least one functional group selected from the group consisting of a carbonyl group-containing group and a hydroxy group; at least one fluorine-free resin selected from the group consisting of a liquid crystal polymer, a polyarylene sulfide, and an aromatic polyether ketone; and particulate boron nitride.