BACKSIDE ILLUMINATION ARCHITECTURES FOR INTEGRATED PHOTONIC LIDAR

A single and dual path light detection and ranging (LiDAR) system can transmit and receive light through a silicon substrate backside of a photonic integrated circuit (PIC). The PIC can be interface with an electrical integrated circuit (EIC) using a front side that connects to the EIC using electri...

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Bibliographische Detailangaben
Hauptverfasser:	GONDARENKO, Alexander Alexeevich, WISER, Robert Francis, COMPSTON, Andrew James, FORTUNE, Steven Andrew, PIGGOTT, Alexander Yukio, NICOLAESCU, Remus
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ANALOGOUS ARRANGEMENTS USING OTHER WAVES DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING FREQUENCY-CHANGING LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION ORRERADIATION OF RADIO WAVES MEASURING MEASURING ANGLES MEASURING AREAS MEASURING IRREGULARITIES OF SURFACES OR CONTOURS MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS PHYSICS RADIO DIRECTION-FINDING RADIO NAVIGATION TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF TESTING
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Beschreibung
Zusammenfassung:	A single and dual path light detection and ranging (LiDAR) system can transmit and receive light through a silicon substrate backside of a photonic integrated circuit (PIC). The PIC can be interface with an electrical integrated circuit (EIC) using a front side that connects to the EIC using electrical contacts and a backside that faces away from the EIC. High density coupler elements (e.g., pixels, gratings) can emit and receive infrared light that propagates through the PIC layers and the backside towards objects to detection.