SOLID-STATE IMAGING ELEMENT AND IMAGING DEVICE

A solid-state imaging device (200) according to the present disclosure includes a light-receiving substrate (201), a circuit board (202), and a plurality of first connections (270). The light-receiving substrate (201) includes a plurality of light-receiving circuits (211) provided with photoelectric...

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Bibliographische Detailangaben
Hauptverfasser:	MURAKAWA, Yusuke, KITANO, Shin, TSUCHIMOTO, Koya, NAKAMURA, Makoto, NODA, Yuki, HANADA, Takuya
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PICTORIAL COMMUNICATION, e.g. TELEVISION SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A solid-state imaging device (200) according to the present disclosure includes a light-receiving substrate (201), a circuit board (202), and a plurality of first connections (270). The light-receiving substrate (201) includes a plurality of light-receiving circuits (211) provided with photoelectric conversion elements. The circuit board (202) is directly bonded to the light-receiving substrate (201) and includes a plurality of address event detection circuits (231) that detects individual changes in voltages output from the photoelectric conversion elements of the plurality of light-receiving circuits (211). The plurality of first connections (270) is provided at a joint (203) between the light-receiving substrate (201) and the circuit board (202) to electrically connect the light-receiving circuits (211) and the address event detection circuits (231) corresponding to each other.