AN INTEGRATED CIRCUIT PACKAGE AND METHOD TO MANUFACTURE THE INTEGRATED CIRCUIT PACKAGE TO REDUCE BOND WIRE DEFECTS IN THE INTEGRATED CIRCUIT PACKAGE

AN INTEGRATED CIRCUIT PACKAGE AND METHOD TO MANUFACTURE THE INTEGRATED CIRCUIT PACKAGE TO REDUCE BOND WIRE DEFECTS IN THE INTEGRATED CIRCUIT PACKAGE

An integrated circuit package is formed by positioning an integrated circuit die on a die pad of a leadframe; connecting a bond wire between the die and a bond pad of the leadframe; encapsulating the bond wire, die, and bond pad with an encapsulant material to form a first mold cap of the integrated...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Han, Mingchuan, Pang, Xingshou, Song, Jian, Xu, Xuesong, Li, Jun, Yao, Jinzhong
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:An integrated circuit package is formed by positioning an integrated circuit die on a die pad of a leadframe; connecting a bond wire between the die and a bond pad of the leadframe; encapsulating the bond wire, die, and bond pad with an encapsulant material to form a first mold cap of the integrated circuit package; after the encapsulating, bending one or more leads of the leadframe to form one or more bent leads; and encapsulating the first mold cap and a portion of a bend of the one or more bent leads with the encapsulant material to form a second mold cap.