ASSEMBLY FOR MATERIAL PROCESSING USING A LASER BEAM, IN PARTICULAR FOR LASER DRILLING

The present invention relates to an assembly for material processing using a laser beam, in particular for laser drilling, comprising a dynamic deflection device (AE) for the laser beam (LS), and an optical assembly, with which a laser beam (LS) exiting the deflection device (AE) is focused onto a p...

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Bibliographische Detailangaben
Hauptverfasser:	HAASLER, Dennis, FINGER, Johannes
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	The present invention relates to an assembly for material processing using a laser beam, in particular for laser drilling, comprising a dynamic deflection device (AE) for the laser beam (LS), and an optical assembly, with which a laser beam (LS) exiting the deflection device (AE) is focused onto a processing plane (W). Along an optical axis, the optical assembly has a first optical system (OS1) and a second optical system (OS2), which are designed and arranged such that the laser beam (LS) forms an intermediate focus (ZF) between the first and the second optical system (OS1, OS2), and intersects the optical axis when entering the first optical system (OS1) at an angle to the optical axis and at a distance therefrom between the second optical system (OS2) and the processing plane (W). The suggested assembly has a simple, stable structure, with which efficient ablation of large and deep boreholes or cuts in a workpiece is enabled.