COPPER-BONDED MEMORY DIES IN A MEMORY STACK WHICH IS COPPER-BONDED TO A LOGIC DIE VIA A BUFFER DIE

COPPER-BONDED MEMORY DIES IN A MEMORY STACK WHICH IS COPPER-BONDED TO A LOGIC DIE VIA A BUFFER DIE

A memory system includes a memory stack including a number of memory dies interconnected via copper bonding, a logic die coupled to the memory stack via a copper bonding. The memory system further includes a buffer die extended to provide the copper bonding between the logic die and the memory stack...

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Bibliographische Detailangaben
1. Verfasser: DUNGAN, Thomas Edward
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A memory system includes a memory stack including a number of memory dies interconnected via copper bonding, a logic die coupled to the memory stack via a copper bonding. The memory system further includes a buffer die extended to provide the copper bonding between the logic die and the memory stack and a silicon carrier layer bonded to the memory stack and the logic die.