FLIP-CHIP BALL GRID ARRAY-TYPE INTEGRATED CIRCUIT PACKAGE FOR VERY HIGH FREQUENCY OPERATION

The invention relates to a flip-chip integrated circuit package (2) of the ball array type, wherein:- the underside of the package includes a plurality of receiving pads (15, 26) for signal, ground and solder balls;- stacks of signal (11, 13) and ground (22) vias, electrically connected to respective receiving pads, pass vertically through the package's dielectric body (6) forming a quasi-coaxial structure. In an upper part of the package body:- the signal vias (11, 13) are electrically connected to a lesser number of signal conductive bumps (9) protruding from the upper surface of the package's dielectric body; and- at least two ground vias (22) are connected by means of conductive projections (30) to respective ground conductive bumps (20), forming a ring around the signal conductive bumps (9).