COOLING MODULE USING SOLID REFRIGERANT AND COOLING SYSTEM USING SOLID REFRIGERANT

A cooling module (20) for solid-state refrigerant cooling includes: an annular storing portion (21) including a housing portion (22); a low-temperature-side inflow path (25); a high-temperature-side inflow path (27); a low-temperature-side outflow path (26); and a high-temperature-side outflow path...

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Bibliographische Detailangaben
1. Verfasser: TERAKI, Junichi
Format: Patent
Sprache:eng ; fre ; ger
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Zusammenfassung:A cooling module (20) for solid-state refrigerant cooling includes: an annular storing portion (21) including a housing portion (22); a low-temperature-side inflow path (25); a high-temperature-side inflow path (27); a low-temperature-side outflow path (26); and a high-temperature-side outflow path (28). A first space (29) is provided between one ends of flow paths (23) and the low-temperature-side inflow path (25), and a second space (30) is provided between the other ends of the flow paths (23) and the high-temperature-side inflow path (27). The cooling module (20) includes a first intermediate flow path (31) for providing fluid communication between the low-temperature-side inflow path (25) and the first space (29) and widening a flow of a heating medium from the low-temperature-side inflow path (25) to the first space (29), and a second intermediate flow path (33) for providing fluid communication between the high-temperature-side inflow path (27) and the second space (30) and widening a flow of the heating medium from the high-temperature-side inflow path (27) to the second space (30).