ELECTROLESS PLATING PROCESS AND TWO-LAYER PLATING FILM

An object is to provide a electroless plating process that enables reduction in production costs and a two-layer plating film obtained by the process. For the purpose of achieving this object, adopted is a electroless plating process for forming a nickel plating film and a gold plating film in this...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	KATO, Tomohito, WATANABE, Hideto
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	An object is to provide a electroless plating process that enables reduction in production costs and a two-layer plating film obtained by the process. For the purpose of achieving this object, adopted is a electroless plating process for forming a nickel plating film and a gold plating film in this order on a surface of a copper material by a electroless plating method, the electroless plating process comprising: a step of forming a nickel plating film containing boron by a reductive electroless nickel strike plating method, and a step of forming a gold plating film by a reductive electroless gold plating method. The two-layer plating film according to the present invention is formed by this process.