HOT STAMP MOLDED BODY

A hot stamped body with high strength and good bendability, comprising a chemical composition consisting of: in mass%, C: 0.06% or more to less than 0.20%, Si: 0.010 to 1.00%, Mn: 1.20 to 3.00%, P: 0.100% or less, S: 0.010% or less, Al: 0.010 to 0.500%, N: 0.010% or less, Nb: 0.0010 to 0.020%, Ti: 0...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: FUJINAKA, Shingo, MAEDA, Daisuke, TODA, Yuri
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:A hot stamped body with high strength and good bendability, comprising a chemical composition consisting of: in mass%, C: 0.06% or more to less than 0.20%, Si: 0.010 to 1.00%, Mn: 1.20 to 3.00%, P: 0.100% or less, S: 0.010% or less, Al: 0.010 to 0.500%, N: 0.010% or less, Nb: 0.0010 to 0.020%, Ti: 0 to 0.10%, V: 0 to 0.10%, Cr: 0 to 0.50%, Mo: 0 to 1.00%, B: 0 to 0.0100%, Ni: 0 to 0.50%, REM: 0 to 0.0100%, Mg: 0 to 0.010%, Ca: 0 to 0.0100%, and Co: 0 to 2.0%, with the balance: Fe and impurities, wherein a microstructure includes martensite: 85% or more, a proportion of regions in the martensite where GAIQ values are 35000 or more to less than 45000 is 30 area% or more, and TS × α, is 105000 or more, and α is 75 or more.