LASER PROCESSING HEAD, LASER PROCESSING SYSTEM, AND METHOD OF DETERMINING ABNORMALITY OF LASER PROCESSING SYSTEM

LASER PROCESSING HEAD, LASER PROCESSING SYSTEM, AND METHOD OF DETERMINING ABNORMALITY OF LASER PROCESSING SYSTEM

Laser processing head 10 includes housing 11 and a plurality of optical components. Housing 11 is provided with partition wall 11a, first and second light entrance ports 12a, 12b through which first and second laser beams A, B respectively enter, and light irradiation port 13. Laser processing head...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: NISHIO, Masatoshi, OGUCHI, Hisayuki
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:Laser processing head 10 includes housing 11 and a plurality of optical components. Housing 11 is provided with partition wall 11a, first and second light entrance ports 12a, 12b through which first and second laser beams A, B respectively enter, and light irradiation port 13. Laser processing head 10 includes first and second photodetectors 91b, 92a provided around first and second light entrance ports 12a, 12b, respectively. First photodetector 91b is disposed opposite to second photodetector 92a across partition wall 11a. First photodetector 91b receives light in the second wavelength band including the wavelength of second laser beam B, and second photodetector 92a receives light in the first wavelength band including the wavelength of first laser beam A.