ULTRA-LOW VISCOSITY ETHYLENE-BUTENE COPOLYMER AND COMPOSITION FOR HOT-MELT ADHESIVE INCLUDING THE SAME

Provided are an ultra-low viscosity ethylene-butene copolymer which is a copolymer derived from ethylene and butene, wherein the ethylene-butene copolymer has a density of 0.874 to 0.900 g/cm3 and a melting point of 63 to 90° C., and a composition for a hot-melt adhesive including the same. The ethy...

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Bibliographische Detailangaben
Hauptverfasser:	JEON, Min Ho, SHIN, Dae Ho, KIM, Ji Eun, CHEONG, Sang Bae, SHIN, Seon Mi, BAE, Ji Hyun, SHIM, Choon Sik
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADHESIVES CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON CORRECTING FLUIDS DYES FILLING PASTES INKS MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS THEREFOR WOODSTAINS
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Beschreibung
Zusammenfassung:	Provided are an ultra-low viscosity ethylene-butene copolymer which is a copolymer derived from ethylene and butene, wherein the ethylene-butene copolymer has a density of 0.874 to 0.900 g/cm3 and a melting point of 63 to 90° C., and a composition for a hot-melt adhesive including the same. The ethylene-butene copolymer according to the present disclosure may be rapidly melted at a certain melting point or higher and may provide a low processing temperature with a significantly low viscosity. In addition, the composition for a hot-melt adhesive according to the present disclosure includes the ethylene-butene copolymer, thereby having excellent thermal resistance with high shear adhesion failure temperature and peel adhesion failure temperature and securing both excellent cohesiveness and adhesive strength.