CU-NI-SI-BASED COPPER ALLOY SHEET MATERIAL, METHOD FOR PRODUCING SAME, AND CURRENT-CARRYING COMPONENT

To provide a copper alloy sheet material having etching characteristics that are advantageous for providing a high dimensional accuracy in etching with an extremely narrow pitch, having a chemical composition containing, in terms of percentage by mass, Ni: 1.00 to 4.50%, Si: 0.10 to 1.40%, and depending on necessity one or more kind of Co, Mg, Cr, P, B, Mn, Sn, Ti, Zr, Al, Fe, Zn, and Ag, having an area ratio SB/SS of 0.40 or more in an EBSD measurement on a cross section perpendicular to a rolling direction, wherein Ss represents an area of a region satisfying at least one of conditions of a crystal orientation difference from the S1 {241} orientation of 10° or less and a crystal orientation difference from the S2 {231} orientation of 10° or less, and SB represents an area of a region having a crystal orientation difference from the Brass {011} orientation of 10° or less.