CUTTING TOOL

A cutting tool includes: a substrate; and a coating film provided on the substrate, whereinthe coating film includes a multilayer structure layer having one or more first unit layers and one or more second unit layers,in the multilayer structure layer, the one or more first unit layers and the one o...

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Bibliographische Detailangaben
Hauptverfasser: KUKINO, Satoru, SANO, Kenta, TSUKIHARA, Nozomi, MATSUKAWA, Michiko
Format: Patent
Sprache:eng ; fre ; ger
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Beschreibung
Zusammenfassung:A cutting tool includes: a substrate; and a coating film provided on the substrate, whereinthe coating film includes a multilayer structure layer having one or more first unit layers and one or more second unit layers,in the multilayer structure layer, the one or more first unit layers and the one or more second unit layers are alternately layered,when X-ray diffraction intensities of a (200) plane, a (111) plane, and a (220) plane in the multilayer structure layer are respectively represented by I(200), I(111), and I(220), the following formula 1 is satisfied: 0.6≤I200/I200+I111+I220each of the one or more first unit layers has a NaCl-like structure in which an interplanar spacing d1c in a c-axis direction is larger than an interplanar spacing d1a in an a-axis direction,each of the one or more second unit layers has a NaCl-like structure in which an interplanar spacing d2c in the c-axis direction is smaller than an interplanar spacing d2a in the a-axis direction, andthe following formulas 2, 3 and 4 are satisfied: 1≤d1a/d2a≤1.021.01≤d1c/d2c≤1.05 and d1a/d2a