METHOD OF MANUFACTURING ELECTRONIC DEVICES AND CORRESPONDING ELECTRONIC DEVICE

METHOD OF MANUFACTURING ELECTRONIC DEVICES AND CORRESPONDING ELECTRONIC DEVICE

A method of manufacturing electronic devices comprises providing at least one substrate (12) having electrically-conductive tracks (13) patterned thereon. The method further comprises arranging on the at least one substrate (12) at least one semiconductor chip, and electrically coupling the at least...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: TIZIANI, Roberto, HERARD, Laurent
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:A method of manufacturing electronic devices comprises providing at least one substrate (12) having electrically-conductive tracks (13) patterned thereon. The method further comprises arranging on the at least one substrate (12) at least one semiconductor chip, and electrically coupling the at least one semiconductor chip to selected ones of the electrically-conductive tracks (13). The method further comprises providing, at selected locations on the electrically-conductive tracks (13), containment structures (80) having respective perimeter walls (74, 76) which define respective cavities configured to accommodate a base portion of respective pin holders (16), and soldering the respective pin holders (16) within the cavities defined by the containment structures (80) on the electrically-conductive tracks (13).