SENSOR DEVICE
A sensor device (1) according to the present disclosure includes: a Peltier element (20); a sensor element (10) thermally connected to a cooling surface (21a) of the Peltier element (20); and a package substrate (40) that is made of ceramic, is thermally connected to a heat dissipation surface (23a)...
Gespeichert in:
| Hauptverfasser: | , |
|---|---|
| Format: | Patent |
| Sprache: | eng ; fre ; ger |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| Zusammenfassung: | A sensor device (1) according to the present disclosure includes: a Peltier element (20); a sensor element (10) thermally connected to a cooling surface (21a) of the Peltier element (20); and a package substrate (40) that is made of ceramic, is thermally connected to a heat dissipation surface (23a) of the Peltier element (20), and accommodates the Peltier element (20) and the sensor element (10). |
|---|