MOISTURE-CURABLE ADHESIVE COMPOSITION

An object of this invention is to provide an adhesive composition that comprises a moisture-curable resin and a modified polyolefin and that achieves an excellent liquid state and excellent adhesion to polyolefin resin substrates. Provided is a moisture-curable adhesive resin composition comprising...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	SAKATA, Hideyuki, KASHIHARA Kenji
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON DYES MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	An object of this invention is to provide an adhesive composition that comprises a moisture-curable resin and a modified polyolefin and that achieves an excellent liquid state and excellent adhesion to polyolefin resin substrates. Provided is a moisture-curable adhesive resin composition comprising a moisture-curable resin (A) and a modified polyolefin resin (B), wherein the content of the modified polyolefin resin (B) is 2 parts by mass or more per 100 parts by mass of the moisture-curable resin (A).