CURABLE ORGANOPOLYSILOXANE COMPOSITION AND CURED PRODUCT THEREOF, PROTECTIVE AGENT OR ADHESIVE, AND ELECTRIC/ELECTRONIC DEVICE

[Problem]To provide a one-component curable organopolysiloxane composition that has excellent storage stability, favorable curability and adhesion at relatively low temperatures, and an appropriate pot life. In particular, to provide a curable organopolysiloxane composition with excellent curability...

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Hauptverfasser: TODA Nohno, SUTOH Manabu
Format: Patent
Sprache:eng ; fre ; ger
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Zusammenfassung:[Problem]To provide a one-component curable organopolysiloxane composition that has excellent storage stability, favorable curability and adhesion at relatively low temperatures, and an appropriate pot life. In particular, to provide a curable organopolysiloxane composition with excellent curability even at temperatures of 80°C or lower and excellent adhesion to resins such as polyester, polyphenylene sulfide, and the like. Furthermore, to provide a curable organopolysiloxane composition that can be cured in a short period of time by increasing the temperature to a high temperature when rapid curing is required.[Resolution Means]A one-component curable organopolysiloxane composition, comprising the following components (A) to (F):(A) an organopolysiloxane having at least two alkenyl groups in each molecule thereof;(B) an organopolysiloxane having at least two silicon atom-bonded hydrogen atoms in a molecule;(C) a photo-active hydrosilylation reaction catalyst;(D) a condensation reaction catalyst;(E) a curing inhibitor; and(F) an adhesion imparting agent having at least one terminal trialkoxysilyl group.