PACKAGING OF POWER CONVERSION UNIT

A mechanical assembly (10) includes a power semiconductor device located inside of a mechanical enclosure (14), and a magnetic component (12) located outside of the mechanical enclosure (14) and operably connected to the power semiconductor device. The power semiconductor device and the magnetic com...

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Bibliographische Detailangaben
Hauptverfasser:	LIAO, XuQiang, ADIBHATLA, Sridhar, SHE, Xu, PANDYA, Daxesh Kishor, VINNAKOTA, Vinay Kumar, BONDAPALLI, Vijaylakshmi
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	A mechanical assembly (10) includes a power semiconductor device located inside of a mechanical enclosure (14), and a magnetic component (12) located outside of the mechanical enclosure (14) and operably connected to the power semiconductor device. The power semiconductor device and the magnetic component (12) are cooled via a common air pathway (22) outside of the mechanical enclosure (14). A power converter (10) includes a powered semiconductor device located inside of a mechanical enclosure (14), the power semiconductor device configured to convert DC input power to AC output power, and an inductor (12) located outside of the mechanical enclosure (14) and operably connected to the power semiconductor device. The power semiconductor device and the magnetic component (12) are cooled via a common air pathway (22) outside of the mechanical enclosure (14).