METHOD AND APPARATUS FOR MANUFACTURING NANOSTRUCTURES FROM A MATERIAL LAYER HAVING A THICKNESS BELOW 1 µM

Provided is a method and an apparatus of manufacturing nano-structures by cutting out portions of a material layer and removing the cut-out portions.

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Bibliographische Detailangaben
Hauptverfasser:	Maaß, Henriette, Schatz, Enno, Le, Thien Anh, Hecht, Bert
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY MANUFACTURE OR TREATMENT OF NANOSTRUCTURES MATERIALS THEREFOR MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES NANOTECHNOLOGY ORIGINALS THEREFOR PERFORMING OPERATIONS PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES TRANSPORTING
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Beschreibung
Zusammenfassung:	Provided is a method and an apparatus of manufacturing nano-structures by cutting out portions of a material layer and removing the cut-out portions.