POWDERED ALUMINIUM MATERIAL

The invention relates to the field of metallurgy, more specifically to a heat-resistant alloy composition on the basis of aluminium and to a powder made therefrom for use for manufacturing components by additive technology methods. A novel material on the basis of aluminium is created, said material...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	VAKHROMOV, Roman Olegovich, CHURYUMOV, Aleksandr Yur'evich, DAUBARAJTE, Dar'ya Konstantinovna, KOROLEV, Vladimir Aleksandrovich, KROKHIN, Aleksandr Yur'evich, SOLONIN, Aleksej Nikolaevich, MANN, Viktor Khrist'yanovich, RYABOV, Dmitrij Konstantinovich
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADDITIVE MANUFACTURING TECHNOLOGY ADDITIVE MANUFACTURING, i.e. MANUFACTURING OFTHREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVEAGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING,STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING ALLOYS CASTING CHEMISTRY FERROUS OR NON-FERROUS ALLOYS MAKING METALLIC POWDER MANUFACTURE OF ARTICLES FROM METALLIC POWDER METALLURGY PERFORMING OPERATIONS POWDER METALLURGY TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WORKING METALLIC POWDER
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Beschreibung
Zusammenfassung:	The invention relates to the field of metallurgy, more specifically to a heat-resistant alloy composition on the basis of aluminium and to a powder made therefrom for use for manufacturing components by additive technology methods. A novel material on the basis of aluminium is created, said material being intended for manufacturing powder and for use thereof in the additive production of various articles, and being highly processible in laser alloying and having high strength characteristics in a thermally processed state: a yield stress of greater than 400 MPa, a tensile strength of greater than 470 MPa, and a percentage of elongation of at least 4%. The powdered aluminium material comprises copper, magnesium, manganese, cerium, silicon, zirconium and/or titanium, wherein the material contains thermally stable dispersoids Al8Cu4Ce of a size of less than 1 µm which form at crystallization rates of at least 103 K/s and contribute to the strengthening of the material in operating conditions at room temperature and at an elevated temperature.