LAYERED STRUCTURES WITH CUTTING LINES

The invention is related to a layered structure with at least one layer a. of a material with a VST≥85° C. comprising at least one cutting line b. reaching through the whole thickness of the layered structure surrounding at least one first portion which is extractable and reinsertable manually from...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: PLANKEN, Kira, WANG, Daopeng, PUDLEINER, Heinz, KOEHLER, Christoph, TZIOVARAS, Georgios, FENG, Meng, ZHAO, Yizhe, JANKE, Stefan, KUENZEL, Roland
Format: Patent
Sprache:eng ; fre ; ger
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Beschreibung
Zusammenfassung:The invention is related to a layered structure with at least one layer a. of a material with a VST≥85° C. comprising at least one cutting line b. reaching through the whole thickness of the layered structure surrounding at least one first portion which is extractable and reinsertable manually from the layered structure as well as a production process for such a layered structure.