CIRCUIT BOARD SOLDERING STRUCTURE

An adverse effect of molten solder flowing down is prevented while a circuit board is reliably and stably connected to a lead plate. A circuit board soldering structure includes lead a plate (2) inserted into a slit hole (30) of a circuit board (3) and soldered to a conductive pattern (31) provided...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	MATSUSHITA, Fumiya, MATSUBARA, Shota
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CURRENT COLLECTORS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LINE CONNECTORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSIONOF CHEMICAL INTO ELECTRICAL ENERGY
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Beschreibung
Zusammenfassung:	An adverse effect of molten solder flowing down is prevented while a circuit board is reliably and stably connected to a lead plate. A circuit board soldering structure includes lead a plate (2) inserted into a slit hole (30) of a circuit board (3) and soldered to a conductive pattern (31) provided along the slit hole (30). The lead plate (2) is made of an elastically-deformable metal plate thinner than an opening width (W) of slit hole (30). The lead plate (2) includes insertion section (20) inserted into the slit hole (30). The insertion section (20) includes a bent section (21) approaching from one of opposing inner surfaces (32) of the slit hole (30) facing each other toward another of the opposing inner surfaces 32 of the slit hole (30). The bent section (21) is disposed in the slit hole (30). The insertion section (20) has both surfaces that are close to or contact corresponding opposing inner surfaces (32) of the slit hole (30) to solder the insertion section (20) to the conductive pattern (31).