FLIP LED CHIP, CIRCUIT BOARD AND ELECTRONIC DEVICE

A flip LED chip (20, 50, 70, 90, 102), a wiring board (100), and an electronic apparatus are provided. The bottom portion of the chip body (21, 51, 91) is provided with two pad slots (210, 710, 910) recessed upwardly, an N electrode pad (221, 921) and a P electrode pad (222, 922) are disposed on bot...

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Bibliographische Detailangaben
Hauptverfasser:	XING, Meizheng, LIU, Yong, SUN, Pingru, CHEN, Yanming
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A flip LED chip (20, 50, 70, 90, 102), a wiring board (100), and an electronic apparatus are provided. The bottom portion of the chip body (21, 51, 91) is provided with two pad slots (210, 710, 910) recessed upwardly, an N electrode pad (221, 921) and a P electrode pad (222, 922) are disposed on bottoms of the two pad slots (210, 710, 910), and a gap is between a side surface of each pad (22, 52, 72, 92) and a side wall of a corresponding pad slot (210, 710, 910). Therefore, upon soldering the flip LED chip (20, 50, 70, 90, 102) on the wiring board (100), the melted solder paste can penetrate the gap and bond to the side surface of the pad (22, 52, 72, 92). Therefore, the bonding between the solder paste and the pad (22, 52, 72, 92) can be achieved more sufficiently, thereby improving the reliability of soldering the flip LED chip (20, 50, 70, 90, 102) with the wiring board (100). Hence, the production yield of the flip LED chip (20, 50, 70, 90, 102) can be apparently improved.