ELECTRONIC COMPONENT, CIRCUIT BOARD HAVING SAME, AND ELECTRONIC DEVICE

An electronic element (22), a circuit board (21) with an electronic element (22), and an electronic device are provided, and relate to the field of electronic device technologies, to shorten a heat dissipation path of the electronic element (22), improve heat dissipation efficiency of the electronic element (22), and ensure input/output impedance matching performance of the electronic element (22). The electronic element (22) includes a substrate (221) and a first input pad (222), at least one chip (223), and a first output pad (224) that are disposed on a first surface (221a) of the substrate(221), where the first input pad (222), the at least one chip (223), and the first output pad (224) are sequentially connected, the first input pad (222) and the first output pad (224) are directly disposed on the first surface (221a) of the substrate (221), and a surface of the first input pad (222) facing away from the substrate (221) and a surface of the first output pad (224) facing away from the substrate (221) constitute a partial area of an outer surface of the electronic element (22). The electronic element (22) is used as a power amplifier.