FLUX AND SOLDER PASTE
Provided are flux in which solder wettability is improved, and a solder paste in which the flux is used. The flux contains 0.5-20.0 wt% of a (2-carboxyalkyl)isocyanurate adduct, and 5.0-45.0 wt% of a rosin, and furthermore contains a solvent. The (2-carboxyalkyl)isocyanurate adduct is a mono(2-carbo...
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Format: | Patent |
Sprache: | eng ; fre ; ger |
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Zusammenfassung: | Provided are flux in which solder wettability is improved, and a solder paste in which the flux is used. The flux contains 0.5-20.0 wt% of a (2-carboxyalkyl)isocyanurate adduct, and 5.0-45.0 wt% of a rosin, and furthermore contains a solvent. The (2-carboxyalkyl)isocyanurate adduct is a mono(2-carboxyalkyl)isocyanurate adduct, a bis(2-carboxyalkyl)isocyanurate adduct, a tris(2-carboxyalkyl)isocyanurate adduct, or a combination of two or more of these. |
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