FLUX AND SOLDER PASTE

Provided are flux in which solder wettability is improved, and a solder paste in which the flux is used. The flux contains 0.5-20.0 wt% of a (2-carboxyalkyl)isocyanurate adduct, and 5.0-45.0 wt% of a rosin, and furthermore contains a solvent. The (2-carboxyalkyl)isocyanurate adduct is a mono(2-carbo...

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Hauptverfasser: TAKAGI, Kazuyori, TAKAKI, Akiko, MINEGISHI, Kazuhiro, KITAZAWA, Kazuya, TSUDA, Ryuichi, KAWASAKI, Hiroyoshi, SHIRATORI, Masato, NAGAI, Tomoko, HORIKOSHI, Rina, MIYAGI, Nanako, OTSUKI, Teppei, HASHIMOTO, Yutaka
Format: Patent
Sprache:eng ; fre ; ger
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Zusammenfassung:Provided are flux in which solder wettability is improved, and a solder paste in which the flux is used. The flux contains 0.5-20.0 wt% of a (2-carboxyalkyl)isocyanurate adduct, and 5.0-45.0 wt% of a rosin, and furthermore contains a solvent. The (2-carboxyalkyl)isocyanurate adduct is a mono(2-carboxyalkyl)isocyanurate adduct, a bis(2-carboxyalkyl)isocyanurate adduct, a tris(2-carboxyalkyl)isocyanurate adduct, or a combination of two or more of these.