COOLING OF HIGH POWER DEVICES USING SELECTIVE PATTERNED DIAMOND SURFACE

COOLING OF HIGH POWER DEVICES USING SELECTIVE PATTERNED DIAMOND SURFACE

A method for efficient heat removal from a semiconducting device made from III-V semiconductor crystals includes depositing a diamond seeding layer on a patterned substrate.

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Bibliographische Detailangaben
Hauptverfasser: BOLKER, Asaf, GOUZMAN, Irina, STEINBERG, Oren, SFEZ, Bruno
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A method for efficient heat removal from a semiconducting device made from III-V semiconductor crystals includes depositing a diamond seeding layer on a patterned substrate.