RESIN COMPOSITION AND MOLDED ARTICLE

An object of the present invention is to provide a resin composition and a molded article each having suppressed surface stickiness while having high stress-relaxing ability and vibration-absorbing ability at room temperature. A resin composition (X) containing 10 to 50 parts by mass of a thermoplas...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	YASUI, Motoyasu, FUKAGAWA, Yoshisada, UEKUSA, Takayuki
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	An object of the present invention is to provide a resin composition and a molded article each having suppressed surface stickiness while having high stress-relaxing ability and vibration-absorbing ability at room temperature. A resin composition (X) containing 10 to 50 parts by mass of a thermoplastic resin (A) and 50 to 90 parts by mass of an inorganic substance (B), wherein a tan δ peak temperature and tan δ peak value, obtained by performing dynamic viscoelastic measurement at a frequency of 10 rad/s (1.6 Hz) in the temperature range of -40 to 150°C, are 0°C or higher and 60°C or lower, and 0.8 or more and 5.0 or less, respectively.