SOLDER ALLOY, SOLDER POWDER, SOLDER PASTE AND SOLDER JOINT

Provided are a solder alloy, a solder powder, a solder paste, and a solder joint, which have excellent mountability, high strength, and excellent thermal fatigue resistance due to low liquidus temperature and not too low solidus temperature. The solder alloy has an alloy composition consisting of, b...

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Bibliographische Detailangaben
Hauptverfasser:	Sasaki, Tomoki, Yamaguchi, Yoshihiro, Tachibana, Yoshie, Sakai, Norikazu
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ALLOYS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING FERROUS OR NON-FERROUS ALLOYS MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	Provided are a solder alloy, a solder powder, a solder paste, and a solder joint, which have excellent mountability, high strength, and excellent thermal fatigue resistance due to low liquidus temperature and not too low solidus temperature. The solder alloy has an alloy composition consisting of, by mass: Ag: 2.0 to 4.0%; Cu: 0.51 to 0.79%; and Bi: more than 4.0% and 8.0% or less, with the balance being Sn. The solder alloy has a liquidus temperature of less than 217°C.