LIGHT-EMITTING ELEMENT MOUNTING PACKAGE AND LIGHT-EMITTING DEVICE

A light emitting element mounting package includes a substrate and an insulating layer, the insulating layer is provided on a first surface of the substrate and has a through hole that penetrates in a direction perpendicular to the first surface, and a wall surface facing the through hole has a step...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: OKAMOTO, Kazuhiro, OKAWA, Yoshihide, MATSUMOTO, Yuhei, YAMAMOTO, Sentarou
Format: Patent
Sprache:eng ; fre ; ger
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Beschreibung
Zusammenfassung:A light emitting element mounting package includes a substrate and an insulating layer, the insulating layer is provided on a first surface of the substrate and has a through hole that penetrates in a direction perpendicular to the first surface, and a wall surface facing the through hole has a stepped portion, in which a diameter of the through hole is small on the side closer to the substrate and is large on the side far from the substrate.