COMPOSITION, CURABLE COMPOSITION, AND CURED PRODUCT

Provided is a composition having excellent compatibility with a fluorine-free epoxy resin even though the composition contains a fluorine-containing epoxy resin. The composition contains:a compound (D) represented by the following formula (D):wherein m is an integer of 0 to 6; p is 0 or 1; q is an i...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	TANAKA, Yoshito, YOSHIYAMA, Asako, KISHIKAWA, Yosuke
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	Provided is a composition having excellent compatibility with a fluorine-free epoxy resin even though the composition contains a fluorine-containing epoxy resin. The composition contains:a compound (D) represented by the following formula (D):wherein m is an integer of 0 to 6; p is 0 or 1; q is an integer of 0 to 6; Rf is a C1-C8 perfluoroalkyl group optionally containing oxygen with one fluorine atom being optionally replaced by a hydrogen atom, and a compound (E) represented by the following formula (E):wherein n is an integer of 0 or greater; and M is a group represented by the following formula (E1):a group represented by the following formula (E2):or a group represented by the following formula (E3):wherein Z is hydrogen or a C1-C10 fluoroalkyl group.