COATING METHOD AND FILM LAYER THEREOF, AND COATING FIXTURE AND APPLICATION THEREOF

COATING METHOD AND FILM LAYER THEREOF, AND COATING FIXTURE AND APPLICATION THEREOF

Provided in the present disclosure are a coating method and a film layer thereof, and a coating fixture and an application thereof. The coating method comprises the steps of: forming a normal film layer on a first component on a substrate surface, and forming at least a thinner film layer on a secon...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SHAN, Wei, ZONG, Jian, DAI, Yingjing, PENG, Ji, LAN, Zhuyao
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
CHEMICAL SURFACE TREATMENT
CHEMISTRY
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING MATERIAL WITH METALLIC MATERIAL
COATING METALLIC MATERIAL
DIFFUSION TREATMENT OF METALLIC MATERIAL
INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL
METALLURGY
SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:Provided in the present disclosure are a coating method and a film layer thereof, and a coating fixture and an application thereof. The coating method comprises the steps of: forming a normal film layer on a first component on a substrate surface, and forming at least a thinner film layer on a second component on the substrate surface, wherein the thickness of the normal film layer is greater than the thickness of the thinner film layer. The coating method can prepare a thinner film layer on the surface of some portions or parts on the substrate surface, and prepare a thicker film layer on the surface of other portions or parts, thereby satisfying the requirements of coating a thinner film layer on some electronic components of the substrate, such as circuit interface components, ensuring data transmission performance.