ONE COMPONENT (1K) CURABLE ADHESIVE COMPOSITION

The present invention is directed to a curable and electrochemically debondable one-component (1K) adhesive composition comprising, based on the weight of the composition:from 40 to 90 wt.% of i) at least one ethylenically unsaturated non-ionic monomer;from 1 to 30 wt.% of ii) non-polymerizable elec...

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Bibliographische Detailangaben
Hauptverfasser: Sundermeier, Uta, Kamm, Thomas, Stapf, Stefanie, Brunstedt, Benjamin
Format: Patent
Sprache:eng ; fre ; ger
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Beschreibung
Zusammenfassung:The present invention is directed to a curable and electrochemically debondable one-component (1K) adhesive composition comprising, based on the weight of the composition:from 40 to 90 wt.% of i) at least one ethylenically unsaturated non-ionic monomer;from 1 to 30 wt.% of ii) non-polymerizable electrolyte;from 0.1 to 10 wt.% of iii) at least one radical generating thermal initiator;from 0 to 20 wt.% of iv) filler; and,from 0 to 20 wt.% of v) toughener.