ONE COMPONENT (1K) CURABLE ADHESIVE COMPOSITION
The present invention is directed to a curable and electrochemically debondable one-component (1K) adhesive composition comprising, based on the weight of the composition:from 40 to 90 wt.% of i) at least one ethylenically unsaturated non-ionic monomer;from 1 to 30 wt.% of ii) non-polymerizable elec...
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Format: | Patent |
Sprache: | eng ; fre ; ger |
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Zusammenfassung: | The present invention is directed to a curable and electrochemically debondable one-component (1K) adhesive composition comprising, based on the weight of the composition:from 40 to 90 wt.% of i) at least one ethylenically unsaturated non-ionic monomer;from 1 to 30 wt.% of ii) non-polymerizable electrolyte;from 0.1 to 10 wt.% of iii) at least one radical generating thermal initiator;from 0 to 20 wt.% of iv) filler; and,from 0 to 20 wt.% of v) toughener. |
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