DIAMOND TOOL

A diamond tool includes a diamond at least on a cutting edge. The diamond includes one or two or more diamond grains. The diamond grain includes a diamond phase composed of a diamond crystal structure and a graphite phase composed of a graphite crystal structure. When a ratio Iπ∗/Iσ∗ between an inte...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	WATANOBE, Naoki, KUKINO, Satoru, HARADA, Takashi
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BORING CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY MILLING PERFORMING OPERATIONS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TRANSPORTING TURNING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A diamond tool includes a diamond at least on a cutting edge. The diamond includes one or two or more diamond grains. The diamond grain includes a diamond phase composed of a diamond crystal structure and a graphite phase composed of a graphite crystal structure. When a ratio Iπ∗/Iσ∗ between an intensity of a π∗ peak derived from a π bond of carbon in the graphite phase and an intensity of a σ∗ peak derived from a σ bond of carbon in the graphite phase and a σ bond of carbon in the diamond phase is determined for the diamond grain by measuring an energy loss associated with excitation of K-shell electrons of carbon by electron energy loss spectroscopy using a transmission electron microscope, the ratio Iπ∗/Iσ∗ of the diamond grain on a surface of the cutting edge is 0.1 to 2 and a ratio Iπ∗/Iσ∗ of the diamond grain at a depth position of 0.5 µm in a normal direction to the surface of the cutting edge from the surface of the cutting edge is 0.001 to 0.1.