CAMERA MODULE, MANUFACTURING METHOD THEREOF AND CORRESPONDING INTELLIGENT TERMINAL
The present application provides a camera module including: a circuit board; a photosensitive element mounted on the circuit board; and a support body formed on the circuit board and surrounding the photosensitive element, and the support body extending towards the photosensitive element and contact...
Gespeichert in:
Hauptverfasser: | , , , |
---|---|
Format: | Patent |
Sprache: | eng ; fre ; ger |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | The present application provides a camera module including: a circuit board; a photosensitive element mounted on the circuit board; and a support body formed on the circuit board and surrounding the photosensitive element, and the support body extending towards the photosensitive element and contacting the photosensitive element; the support body and the circuit board are fixed together to form a combined body, and the combined body has a side face including an indented surface indented towards the direction of the photosensitive element, one end of the indented surface being located at the bottom surface of the circuit board. The present application also provides a corresponding method for manufacturing a camera module and an intelligent terminal with built-in camera module. The present application can further increase the screen-to-body ratio of the intelligent terminal, allowing the thickness of the intelligent terminal to be further decreased, enables easy processing, and can prepare a miniaturized camera module having a good structural strength. |
---|