HIGH TEMPERATURE PRINTED CIRCUIT BOARD SUBSTRATE

The present invention includes a method of creating high temperature mechanically and thermally stabilized PCB fabrication on a photo-definable glass substrate or photosensitive glass substrate.

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Bibliographische Detailangaben
1. Verfasser:	FLEMMING, Jeb H
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	The present invention includes a method of creating high temperature mechanically and thermally stabilized PCB fabrication on a photo-definable glass substrate or photosensitive glass substrate.