A SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING OF A SEMICONDUCTOR DEVICE

A SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING OF A SEMICONDUCTOR DEVICE

This present invention relates to a semiconductor device comprising a lead frame, a metal pad, wherein the metal pad is connected to a back side of the semiconductor device via the lead frame. The semiconductor device further comprises a die pad, wherein the die pad is attached to the lead frame via...

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Hauptverfasser: Wong, Fei, Chau, On Lok, Bi, Billie, Hor, William, Shiu, Ivan
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator Wong, Fei
Chau, On Lok
Bi, Billie
Hor, William
Shiu, Ivan
description This present invention relates to a semiconductor device comprising a lead frame, a metal pad, wherein the metal pad is connected to a back side of the semiconductor device via the lead frame. The semiconductor device further comprises a die pad, wherein the die pad is attached to the lead frame via a die attach material, and an encapsulant that is disposed on the top surface of the lead frame. The encapsulant isolates the metal pad from the die pad.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title A SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING OF A SEMICONDUCTOR DEVICE
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