A SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING OF A SEMICONDUCTOR DEVICE

This present invention relates to a semiconductor device comprising a lead frame, a metal pad, wherein the metal pad is connected to a back side of the semiconductor device via the lead frame. The semiconductor device further comprises a die pad, wherein the die pad is attached to the lead frame via...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	Wong, Fei, Chau, On Lok, Bi, Billie, Hor, William, Shiu, Ivan
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	This present invention relates to a semiconductor device comprising a lead frame, a metal pad, wherein the metal pad is connected to a back side of the semiconductor device via the lead frame. The semiconductor device further comprises a die pad, wherein the die pad is attached to the lead frame via a die attach material, and an encapsulant that is disposed on the top surface of the lead frame. The encapsulant isolates the metal pad from the die pad.